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  ? semiconductor components industries, llc, 2000 october, 2000 rev. 2 1 publication order number: mbr0530t1/d mbr0530t1, mbr0530t3 preferred devices surface mount schottky power rectifier plastic sod123 package ...using the sc hottky barrier principle with a large area metaltosilicon power diode. ideally suited for low voltage, high frequency rectification or as free wheeling and polarity protection diodes in surface mount applications where compact size and weight are critical to the system. this package also provides an easy to work with alternative to leadless 34 package style. these stateoftheart devices have the following features: ? guardring for stress protection ? low forward voltage ? 125 c operating junction temperature ? epoxy meets ul94, vo at 1/8 ? package designed for optimal automated board assembly mechanical characteristics ? reel options: mbr0530t1 = 3,000 per 7 reel/8 mm tape reel options: mbr0530t3 = 10,000 per 13 reel/8 mm tape ? device marking: b3 ? polarity designator: cathode band ? weight: 11.7 mg (approximately) ? case: epoxy, molded ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead and mounting surface temperature for soldering purposes: 260 c max. for 10 seconds maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 30 v average rectified forward current (rated v r , t l = 100 c) i f(av) 0.5 a nonrepetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 5.5 a storage temperature range t stg 65 to +125 c operating junction temperature t j 65 to +125 c voltage rate of change (rated v r ) dv/dt 1000 v/  s device package shipping ordering information mbr0530t1 sod123 http://onsemi.com sod123 case 425 style 1 3000/tape & reel schottky barrier rectifier 0.5 amperes 30 volts preferred devices are recommended choices for future use and best overall value. mbr0530t3 sod123 10,000/tape & reel marking diagram b3 b3 = device code
mbr0530t1, mbr0530t3 http://onsemi.com 2 thermal characteristics rating symbol value unit thermal resistance e junction to ambient (note 1.) r q ja 206 c/w thermal resistance e junction to lead r q jl 150 c/w electrical characteristics maximum instantaneous forward voltage (note 2.) (i f = 0.1 amps, t j = 25 c) (i f = 0.5 amps, t j = 25 c) v f 0.375 0.43 volts maximum instantaneous reverse current (note 2.) (rated dc voltage, t c = 25 c) (v r = 15 v, t c = 25 c) i r 130 20 m a 1. 1 inch square pad size (1 x 0.5 inch for each lead) on fr4 board. 2. pulse test: pulse width = 300 m s, duty cycle 2%. 1 0.1 0.01 0.15 v f , instantaneous voltage (volts) figure 1. typical forward voltage 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 i f , instantaneous forward current (amps) 10 4 1000 v r , reverse voltage (volts) figure 2. typical reverse current 5 101520 303540 25 100 10 1 0 t j = 125 c 75 c 25 c -40 c 75 c 25 c i r , reverse current (a) m 180 160 20 v r , reverse voltage (volts) figure 3. typical capacitance 5101520 30 25 140 120 100 0 typical capacitance at 0 v = 170 pf c, capacitance (pf) 40 60 80 t j = 125 c
mbr0530t1, mbr0530t3 http://onsemi.com 3 1 0.875 0 lead temperature ( c) figure 4. current derating (lead) 67 74 81 88 130 95 0.75 0.625 0.5 60 average forward current (amp) 0.125 0.25 0.375 123 116 109 102 dc square wave = p = 5 = 10 i pk /i av = 20 0.35 0.315 0 i f(av) , average forward current (amp) figure 5. power dissipation 0.1 0.2 0.3 0.4 0.8 0.5 0.28 0.245 0.21 0 0.105 0.14 0.175 0.7 0.6 dc square wave = p = 5 = 10 i pk /i av = 20 0.07 0.035 p f(av) , average power dissipation (watt) t j = 125 c recommended footprint for sod123 sod123 mm inches 0.91 0.036 1.22 0.048 2.36 0.093 4.19 0.165
mbr0530t1, mbr0530t3 http://onsemi.com 4 package dimensions sod123 plastic case 42504 issue c notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. style 1: pin 1. cathode 2. anode aaa aaa b d k a c e j 1 2 h dim min max min max millimeters inches a 0.055 0.071 1.40 1.80 b 0.100 0.112 2.55 2.85 c 0.037 0.053 0.95 1.35 d 0.020 0.028 0.50 0.70 e 0.004 --- 0.25 --- h 0.000 0.004 0.00 0.10 j --- 0.006 --- 0.15 k 0.140 0.152 3.55 3.85 on semiconductor and are trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. atypicalo parameters which may be provided in scill c data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body , or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthori zed use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. publication ordering information central/south america: spanish phone : 3033087143 (monfri 8:00am to 5:00pm mst) email : onlitspanish@hibbertco.com tollfree from mexico: dial 018002882872 for access then dial 8662979322 asia/pacific : ldc for on semiconductor asia support phone : 3036752121 (tuefri 9:00am to 1:00pm, hong kong time) toll free from hong kong & singapore: 00180044223781 email : onlitasia@hibbertco.com japan : on semiconductor, japan customer focus center 4321 nishigotanda, shinagawaku, tokyo, japan 1410031 phone : 81357402700 email : r14525@onsemi.com on semiconductor website : http://onsemi.com for additional information, please contact your local sales representative. mbr0530t1/d north america literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 3036752175 or 8003443860 toll free usa/canada fax : 3036752176 or 8003443867 toll free usa/canada email : onlit@hibbertco.com fax response line: 3036752167 or 8003443810 toll free usa/canada n. american technical support : 8002829855 toll free usa/canada europe: ldc for on semiconductor european support german phone : (+1) 3033087140 (monfri 2:30pm to 7:00pm cet) email : onlitgerman@hibbertco.com french phone : (+1) 3033087141 (monfri 2:00pm to 7:00pm cet) email : onlitfrench@hibbertco.com english phone : (+1) 3033087142 (monfri 12:00pm to 5:00pm gmt) email : onlit@hibbertco.com european tollfree access*: 0080044223781 *available from germany, france, italy, uk, ireland


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